Latest job information from PERSOL APAC for the position of Automotive Physical Design Principal Engineer. If the Automotive Physical Design Principal Engineer vacancy in Singapore matches your qualifications, please submit your latest application or CV directly through the updated Jobkos job portal.
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**About Our Client:**
We are delighted to be partnering with a globally recognized industry frontrunner in information and communications technology (ICT) infrastructure and intelligent devices. This esteemed organization is dedicated to providing comprehensive, full-stack, and all-scenario solutions, delivering cutting-edge products and services to telecommunication carriers, enterprises, governmental bodies, and individual consumers worldwide.
Our distinguished client is actively seeking a highly skilled **Automotive Physical Design Principal Engineer** to enrich their dynamic team.
**Key Responsibilities:**
1. Spearhead the physical design efforts for automotive-grade System-on-Chip (SoC) devices, overseeing the complete implementation lifecycle from RTL (Register-Transfer Level) to GDS (Graphic Design System) while rigorously adhering to functional safety (ISO 26262) standards.
2. Partner closely with the front-end design division, contributing to architecture assessments, logic synthesis, and power optimization initiatives, specifically targeting improvements in the timing, area, and power efficiency of CPU cores.
3. Champion the development of superior PPA (Power, Performance, Area) metrics, driving innovation and achieving significant technical advancements through the adoption of cutting-edge process nodes and tailored optimization approaches.
4. Proactively address and resolve complex technical hurdles in physical design, encompassing critical aspects like timing closure, signal integrity (SI), power integrity (PI), and yield optimization.
5. Pioneer the introduction and validation of emergent technologies and tool chains, thereby propelling ongoing innovation within physical design methodologies specifically for automotive-grade chip development.
**Essential Qualifications:**
1. A tertiary qualification at Bachelor’s level or higher in Microelectronics, Electronic Engineering, Computer Science, or a closely related discipline.
2. Demonstrated expertise in digital chip back-end flows, including Place & Route (P&R), Static Timing Analysis (STA), and power analysis, complemented by a foundational comprehension of digital front-end design and RTL synthesis.
3. Substantial experience in physical optimization for high-performance cores (e.g., CPU/GPU), coupled with a working knowledge of low-power design methodologies. Possess a profound understanding of functional safety specifications and the capability to integrate ISO 26262 requirements directly into the physical design phase.
4. Exceptional proficiency in industry-standard EDA tools (such as Innovus, ICC2, PrimeTime, Voltus, etc.), alongside complete command of the physical verification (DRC/LVS/ERC) workflow.
5. A minimum of 5+ years of hands-on experience in automotive-grade SoC physical design, evidenced by a successful history of leading at least two commercially successful, mass-produced projects.
Aspiring candidates who are keen to apply for this exciting opportunity are invited to click on "Apply Now". Kindly note that only applicants who meet our initial screening criteria will be contacted.
EA License No.: 01C4394
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Job Info:
Company: PERSOL APAC
Position: Automotive Physical Design Principal Engineer
Work Location: Singapore
Country: SG
How to Submit an Application:
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