AOI & Reflow Process Engineer for Advanced Packaging at Consortium for Clinical Research and Innovation Singapore

Position AOI & Reflow Process Engineer for Advanced Packaging
Posted 08 May 2026
Expired 07 Jun 2026
Company Consortium for Clinical Research and Innovation Singapore
Location Singapore | SG
Job Type Full Time

Job Description:

Latest job information from Consortium for Clinical Research and Innovation Singapore for the position of AOI & Reflow Process Engineer for Advanced Packaging. If the AOI & Reflow Process Engineer for Advanced Packaging vacancy in Singapore matches your qualifications, please submit your latest application or CV directly through the updated Jobkos job portal.

Please note that applying for a job may not always be easy, as new candidates must meet certain qualifications and requirements set by the company. We hope the career opportunity at Consortium for Clinical Research and Innovation Singapore for the position of AOI & Reflow Process Engineer for Advanced Packaging below matches your qualifications.

Consortium for Clinical Research and Innovation Singapore is looking for a skilled engineer to develop and optimize AOI and reflow process technologies. The role requires a Bachelor's degree and at least 3 years of relevant experience in semiconductor backend processes. Responsibilities include developing inspection conditions, operating AOI systems, and conducting defect analysis. Successful candidates will benefit from a competitive remuneration package and comprehensive benefits. #J-18808-Ljbffr

Job Info:

  • Company: Consortium for Clinical Research and Innovation Singapore
  • Position: AOI & Reflow Process Engineer for Advanced Packaging
  • Work Location: Singapore
  • Country: SG

How to Submit an Application:

After reading and understanding the criteria and minimum qualification requirements explained in the job information AOI & Reflow Process Engineer for Advanced Packaging at the office Singapore above, immediately complete the job application files such as a job application letter, CV, photocopy of diploma, transcript, and other supplements as explained above. Submit via the Next Page link below.

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